M. Sawa

According to our database, M. Sawa authored at least 3 papers between 2008 and 2023.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2023

Copper Electrode Surface Features and Cu-SiO2Hybrid Bonding.

Mariappan Murugesan, M. Sawa, E. Sone, Makoto Motoyoshi, Mitsumasa Koyanagi, Takafumi Fukushima

Proceedings of the IEEE International 3D Systems Integration Conference, 2023

2021

Cu-Cu Direct Bonding Through Highly Oriented Cu Grains for 3D-LSI Applications.

Mariappan Murugesan, E. Sone, A. Simomura, Makoto Motoyoshi, M. Sawa, K. Fukuda, Mitsumasa Koyanagi, Takafumi Fukushima

Proceedings of the IEEE International 3D Systems Integration Conference, 2021

2008

An Addressing Scheme On Complete Bipartite Graphs.

H. Fujii, M. Sawa

Ars Comb., 2008