M. Shafkat M. Khan

According to our database, M. Shafkat M. Khan authored at least 5 papers between 2022 and 2025.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2025

Toward Standardized Vulnerability Assessment of Advanced Packaging Against Probing Attacks.

M. Shafkat M. Khan, Liton Kumar Biswas, Himanandhan Reddy Kottur, Rouhan Noor, Nitin Varshney, Nelson Hastings, Navid Asadizanjani

IEEE Des. Test, August, 2025

Inherent Hardware Identifiers: Advancing IC Traceability and Provenance in the Multi-Die Era.

M. Shafkat M. Khan, Chengjie Xi, Nitin Varshney, Je-Hyeong Bahk, Navid Asadizanjani

J. Electron. Test., February, 2025

From Design to Inspection: Can Inspection-aware Design Enhance Reliability in Advanced Packaging?

Katayoon Yahyaei, M. Shafkat M. Khan, Navid Asadizanjani

Proceedings of the 43rd IEEE VLSI Test Symposium, 2025

2023

US Microelectronics Packaging Ecosystem: Challenges and Opportunities.

Rouhan Noor, Himanandhan Reddy Kottur, Patrick J. Craig, Liton Kumar Biswas, M. Shafkat M. Khan, Nitin Varshney, Hamed Dalir, Elif Akçali, Bahar Ghane Motlagh, Charles Woychik, Yong-Kyu Yoon, Navid Asadizanjani

CoRR, 2023

2022

Secure Interposer-Based Heterogeneous Integration.

M. Shafkat M. Khan, Chengjie Xi, Aslam A. Khan, M. Tanjidur Rahman, Mark Tehranipoor, Navid Asadizanjani

IEEE Des. Test, 2022