Mengyi Ren
Orcid: 0000-0003-2486-3014
According to our database1,
Mengyi Ren
authored at least 4 papers
between 2021 and 2024.
Collaborative distances:
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Bibliography
2024
IEEE Trans. Ind. Electron., February, 2024
2022
Design and Analysis of a Non-Contact Tension Testing Device Based on Magnetic Levitation.
IEEE Access, 2022
Proceedings of the IEEE/ASME International Conference on Advanced Intelligent Mechatronics, 2022
2021
Proceedings of the IECON 2021, 2021