Noboru Asahi

According to our database, Noboru Asahi authored at least 2 papers between 2015 and 2019.

Collaborative distances:

• Dijkstra number of six.
• Erdős number of five.

2019

Collective and Gang Bonding for Three-Dimensional Integrated Circuits in Chip-on-Wafer Process.

Hiroto Tanaka, Yoshiyuki Arai, Toshiyuki Jinda, Noboru Asahi, Katsumi Terada

Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019

2015

High productivity thermal compression bonding for 3D-IC.

Noboru Asahi, Yoshinori Miyamoto, Masatsugu Nimura, Yoshihito Mizutani, Yoshiyuki Arai

Proceedings of the 2015 International 3D Systems Integration Conference, 2015