Paul-Vahe Cicek

Orcid: 0000-0002-3665-0721

Affiliations:
  • Université du Québec à Montréal, UQÁM, Department of Computer Sciences, Canada
  • McGill University, Montreal, Canada


According to our database1, Paul-Vahe Cicek authored at least 12 papers between 2008 and 2023.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

Legend:

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Bibliography

2023
A Lean Noise-Cancelling Sturdy MASH Delta-Sigma ADC with a Noise-Shaping SAR Stage.
Proceedings of the 30th IEEE International Conference on Electronics, Circuits and Systems, 2023

2022
A Study of Optimizing Lamb Wave Acoustic Mass Sensors' Performance through Adjustment of the Transduction Electrode Metallization Ratio.
Sensors, 2022

A Surface-Micromachined Levitating MEMS Speaker.
Proceedings of the 20th IEEE Interregional NEWCAS Conference, 2022

2021
A System in Package Based on a Piezoelectric Micromachined Ultrasonic Transducer Matrix for Ranging Applications.
Sensors, 2021

A Simple, Versatile Integration Platform based on a Printed Circuit Board for Lab-on-a-Chip Systems.
Proceedings of the 28th IEEE International Conference on Electronics, 2021

2013
A 0.13-µm CMOS Interface Circuit for a MEMS Resonator-Based Vacuum Measurement System.
IEEE Trans. Circuits Syst. I Regul. Pap., 2013

Ultra low-power low-noise transimpedance amplifier for MEMS-based reference oscillators.
Proceedings of the 20th IEEE International Conference on Electronics, 2013

2010
A MEMS-based temperature-compensated vacuum sensor for low-power monolithic integration.
Proceedings of the International Symposium on Circuits and Systems (ISCAS 2010), May 30, 2010

2009
A Highly Integrated 1.8 GHz Frequency Synthesizer Based on a MEMS Resonator.
IEEE J. Solid State Circuits, 2009

Low actuation voltage silicon carbide RF switches for MEMS above IC.
Proceedings of the 16th IEEE International Conference on Electronics, 2009

A MEMS-based vacuum sensor with a PLL frequency-to-voltage converter.
Proceedings of the 16th IEEE International Conference on Electronics, 2009

2008
MEMS wafer-level vacuum packaging with transverse interconnects for CMOS integration.
Proceedings of the IEEE 2008 Custom Integrated Circuits Conference, 2008


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