Philipp-Immanuel Dietrich

According to our database1, Philipp-Immanuel Dietrich authored at least 10 papers between 2016 and 2022.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

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Links

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Bibliography

2022
3D-Printed Optical Elements for Coupling of VCSEL and Photodiode Arrays to Multi-Core Fibers in an SFP Transceiver Assembly.
Proceedings of the Optical Fiber Communications Conference and Exhibition, 2022

2020
InP/Silicon Hybrid External-Cavity Lasers (ECL) using Photonic Wirebonds as Coupling Elements.
Proceedings of the Optical Fiber Communications Conference and Exhibition, 2020

2018
Efficient Coupling Interfaces in Photonic Systems Enabled by Printed Freeform Micro-Optics.
Proceedings of the 2018 20th International Conference on Transparent Optical Networks (ICTON), 2018

3D-Printed Optics for Wafer-Scale Probing.
Proceedings of the European Conference on Optical Communication, 2018

Photonic Wire Bonding and 3D Nanoprinting in Photonic Integration - from Lab Demonstrations to Production.
Proceedings of the European Conference on Optical Communication, 2018

Hardwired Configurable Photonic Integrated Circuits Enabled by 3D Nanoprinting.
Proceedings of the European Conference on Optical Communication, 2018

2017
8-Channel 448 Gbit/s silicon photonic transmitter enabled by photonic wire bonding.
Proceedings of the Optical Fiber Communications Conference and Exhibition, 2017

Four-Channel 784 Gbit/s Transmitter Module Enabled by Photonic Wire Bonding and Silicon-Organic Hybrid Modulators.
Proceedings of the European Conference on Optical Communication, 2017

2016
Multi-chip integration by photonic wire bonding: Connecting surface and edge emitting lasers to silicon chips.
Proceedings of the Optical Fiber Communications Conference and Exhibition, 2016

Silicon photonic integrated circuits for optical coherence tomography.
Proceedings of the 18th International Conference on Transparent Optical Networks, 2016


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