Pik Kee Tan

According to our database, Pik Kee Tan authored at least 7 papers between 2015 and 2018.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2018

Cross-sectional nanoprobing sample preparation on sub-micron device with fast laser grooving technique.

Pik Kee Tan, Yuzhe Zhao, Francis Rivai, Binghai Liu, Yanlin Pan, Ran He, Hao Tan, Zhihong Mai

Microelectron. Reliab., 2018

Solving 28 nm I/O circuit reliability issue due to IC design weakness.

Yi Chao Low, Pik Kee Tan, Soon Leng Tan, Yuzhe Zhao, Jeffrey Lam

Microelectron. Reliab., 2018

Failure analysis on 14 nm FinFET devices with ESD CDM failure.

Shaalini Chithambaram, Pik Kee Tan, Yuzhe Zhao, Binghai Liu, Yinzhe Ma, Alfred Quah, Dayanand Nagalingam, Yanlin Pan, Zhihong Mai

Microelectron. Reliab., 2018

2016

Application of Fast Laser Deprocessing Techniques on large cross-sectional view area sample with FIB-SEM dual beam system.

Yuzhe Zhao, Q. J. Wang, Pik Kee Tan, Huei Hao Yap, Binghai Liu, H. Feng, Hao Tan, Ran He, Y. M. Huang, D. D. Wang, Lei Zhu, C. Q. Chen, Francis Rivai, Jeffrey Lam, Zhihong Mai

Microelectron. Reliab., 2016

Application of laser deprocessing technique in PFA on chemical over-etched on bond-pad issue.

Huei Hao Yap, Pik Kee Tan, Lei Zhu, H. Feng, Y. Z. Zhao, Ran He, Hao Tan, B. Liu, Y. M. Huang, D. D. Wang, Jeffrey Lam, Zhihong Mai

Microelectron. Reliab., 2016

Cross-sectional nanoprobing fault isolation technique on submicron devices.

Pik Kee Tan, Huei Hao Yap, Changqing Chen, Francis Rivai, Yu Zhe Zhao, Lei Zhu, Hua Feng, Hao Tan, Ran He, D. D. Wang, Y. M. Huang, Yin Zhe Ma, Jeffrey Lam, Zhi Hong Mai

Microelectron. Reliab., 2016

2015

Top-down delayering to expose large inspection area on die side-edge with Platinum (Pt) deposition technique.

Huei Hao Yap, Pik Kee Tan, G. R. Low, M. K. Dawood, H. Feng, Y. Z. Zhao, Ran He, Hao Tan, J. Zhu, B. Liu, Y. M. Huang, D. D. Wang, Jeffrey Lam, Zhihong Mai

Microelectron. Reliab., 2015