R. Bonda

According to our database1, R. Bonda authored at least 1 paper in 2012.

Collaborative distances:
  • Dijkstra number2 of seven.
  • Erdős number3 of six.

Timeline

Legend:

Book 
In proceedings 
Article 
PhD thesis 
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Links

On csauthors.net:

Bibliography

2012
High-lead flip chip bump cracking on the thin organic substrate in a module package.
Microelectron. Reliab., 2012


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