Rei Sakura

Orcid: 0000-0002-2324-8100

According to our database¹, Rei Sakura authored at least 3 papers between 2022 and 2023.

Collaborative distances:

Dijkstra number² of five.
Erdős number³ of five.

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2023

Demonstrating LattiSense: A 3D-Printable Resistive Deformation Sensor with Lattice Structures.

[BibT_eX]

[DOI]

Proceedings of the 8th ACM Symposium on Computational Fabrication, 2023

LattiSense: A 3D-Printable Resistive Deformation Sensor with Lattice Structures.

[BibT_eX]

[DOI]

Proceedings of the 8th ACM Symposium on Computational Fabrication, 2023

2022

Design of 3D-Printed Soft Sensors for Wire Management and Customized Softness.

[BibT_eX]

[DOI]

Proceedings of the CHI '22: CHI Conference on Human Factors in Computing Systems, New Orleans, LA, USA, 29 April 2022, 2022

Rei Sakura

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