S. C. Hung

According to our database1, S. C. Hung
  • authored at least 4 papers between 2001 and 2006.
  • has a "Dijkstra number"2 of six.

Timeline

Legend:

Book 
In proceedings 
Article 
PhD thesis 
Other 

Links

On csauthors.net:

Bibliography

2006
A study in flip-chip UBM/bump reliability with effects of SnPb solder composition.
Microelectronics Reliability, 2006

2003
Solder joint reliability of TFBGA assemblies with fresh and reworked solder balls.
Microelectronics Reliability, 2003

2002
Board level reliability of a stacked CSP subjected to cyclic bending.
Microelectronics Reliability, 2002

2001
Board level reliability of PBGA using flex substrate.
Microelectronics Reliability, 2001


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