Shinya Takyu

According to our database, Shinya Takyu authored at least 2 papers between 2019 and 2024.

Collaborative distances:

• Dijkstra number of six.
• Erdős number of five.

2024

A Novel Direct Transfer Bonding Process with Particle Less Tapes for Die to Wafer Integration.

Tomoka Kirihata, Masanori Yamagishi, Ichiro Sano, Haruka Morita, Yusuke Fumita, Shinya Takyu

Proceedings of the International 3D Systems Integration Conference, 2024

2019

Study of Optimizing Stress-Strain Curve of Adhesive for High Expansion Tape.

Tadatomo Yamada, Ken Takano, Toshiaki Menjo, Shinya Takyu

Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019