Te-yuan Chung

According to our database1, Te-yuan Chung authored at least 2 papers between 2012 and 2015.

Collaborative distances:
  • Dijkstra number2 of six.
  • Erdős number3 of six.

Timeline

Legend:

Book 
In proceedings 
Article 
PhD thesis 
Dataset
Other 

Links

On csauthors.net:

Bibliography

2015
Study of Al-Cu compounds as soldering bond pad for high-power device packaging.
Microelectron. Reliab., 2015

2012
A study of large area die bonding materials and their corresponding mechanical and thermal properties.
Microelectron. Reliab., 2012


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