Thomas R. Souvignet

According to our database, Thomas R. Souvignet authored at least 13 papers between 2014 and 2026.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of three.

2026

Forensic qualification of fault-assisted access restoration on CMD42-locked eMMC: A case study.

Nicolas Hugget, Thomas R. Souvignet, Thibaut Heckmann, David Naccache

Forensic Sci. Int. Digit. Investig., 2026

2024

Uncertainty and error in location traces.

Cléo Berger, Benoît Meylan, Thomas R. Souvignet

Forensic Sci. Int. Digit. Investig., 2024

2022

A forensic analysis of the Google Home: repairing compressed data without error correction.

Hadrien Barral, Georges-Axel Jaloyan, Fabien Thomas-Brans, Matthieu Regnery, Rémi Géraud-Stewart, Thibaut Heckmann, Thomas R. Souvignet, David Naccache

Digit. Investig., 2022

2021

Medical Equipment Used for Forensic Data Extraction: A low-cost solution for forensic laboratories not provided with expensive diagnostic or advanced repair equipment.

Thibaut Heckmann, Thomas R. Souvignet, Damien Sauveron, David Naccache

Digit. Investig., 2021

2020

From Lucky Luke to Lock Bits.

Thomas R. Souvignet, Thibaut Heckmann, Timothy Bollé

IEEE Secur. Priv., 2020

"Hello are you available?" Dealing with online frauds and the role of forensic science.

Olivier Ribaux, Thomas R. Souvignet

Digit. Investig., 2020

Structuring the Evaluation of Location-Related Mobile Device Evidence.

Eoghan Casey, David-Olivier Jaquet-Chiffelle, Hannes Spichiger, Elénore Ryser, Thomas R. Souvignet

Digit. Investig., 2020

2019

Decrease of energy deposited during laser decapsulation attacks by dyeing and pigmenting the ECA: Application to the forensic micro-repair of wire bonding.

Thibaut Heckmann, Thomas R. Souvignet, David Naccache

Digit. Investig., 2019

2018

Forensic smartphone analysis using adhesives: Transplantation of Package on Package components.

Thibaut Heckmann, Konstantinos Markantonakis, David Naccache, Thomas R. Souvignet

Digit. Investig., 2018

2017

Electrically conductive adhesives, thermally conductive adhesives and UV adhesives in data extraction forensics.

Thibaut Heckmann, Thomas R. Souvignet, David Naccache

Digit. Investig., 2017

2016

Low-temperature low-cost 58 Bismuth - 42 Tin alloy forensic chip re-balling and re-soldering.

Thibaut Heckmann, Thomas R. Souvignet, S. Lepeer, David Naccache

Digit. Investig., 2016

2014

Case study: From embedded system analysis to embedded system based investigator tools.

Thomas R. Souvignet, T. Prüfer, J. Frinken, R. Kricsanowits

Digit. Investig., 2014

Payment card forensic analysis: From concepts to desktop and mobile analysis tools.

Thomas R. Souvignet, Julien Hatin, Fabrice Maqua, D. Tesniere, Pierre Léger, Romain Hormière

Digit. Investig., 2014