Tie Qiu

Orcid: 0000-0002-2176-2501

Affiliations:
  • Singapore University of Technology and Design, Engineering Product Development Pillar, Singapore
  • Nanyang Technological University, School of Electrical and Electronic Engineering, Singapore (former)


According to our database1, Tie Qiu authored at least 2 papers between 2014 and 2020.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

Legend:

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Links

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Bibliography

2020
A Compact High-Resolution Resonance-Based Capacitive Sensor for Defects Detection on PCBAs.
IEEE Access, 2020

2014
Microwave power sensor calibration using direct comparison technique with different adaptors.
Proceedings of the 2014 IEEE Ninth International Conference on Intelligent Sensors, 2014


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