Tiwei Wei

According to our database, Tiwei Wei authored at least 3 papers between 2023 and 2025.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2025

3D-CIMlet: A Chiplet Co-Design Framework for Heterogeneous In-Memory Acceleration of Edge LLM Inference and Continual Learning.

Shuting Du, Luqi Zheng, Aradhana Mohan Parvathy, Feifan Xie, Tiwei Wei, Anand Raghunathan, Haitong Li

Proceedings of the 62nd ACM/IEEE Design Automation Conference, 2025

2024

A Novel Multi-Chip Cooling System Using Direct-on-Chip Jet Impingemnt for High-Performance Interposer Package.

Akshat Hetal Patel, Ketan Yogi, Gopinath Sahu, Tiwei Wei

Proceedings of the International 3D Systems Integration Conference, 2024

2023

High Efficiency Polymer based Direct Multi-jet Impingement Cooling Solution for High Power Devices.

Tiwei Wei

CoRR, 2023