Tsubasa Bandoh

According to our database, Tsubasa Bandoh authored at least 1 paper in 2014.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2014

Small-diameter TSV reveal process using direct Si/Cu grinding and metal contamination removal.

Naoya Watanabe, Masahiro Aoyagi, Daisuke Katagawa, Tsubasa Bandoh, Takahiko Mitsui, Eiichi Yamamoto

Proceedings of the 2014 International 3D Systems Integration Conference, 2014