Vithyacharan Retnasamy

Orcid: 0000-0001-7187-0108

According to our database1, Vithyacharan Retnasamy authored at least 8 papers in 2013.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of six.

Timeline

Legend:

Book 
In proceedings 
Article 
PhD thesis 
Dataset
Other 

Links

Online presence:

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Bibliography

2013
High Power LED Thermal and Stress Simulation on Copper Slug.
Proceedings of the 15th International Conference on Computer Modelling and Simulation, 2013

Stress and Temperature Simulation Using Copper-Diamond Composite Slug.
Proceedings of the 15th International Conference on Computer Modelling and Simulation, 2013

Solid State Lighting Stress and Junction Temperature Evaluation on Operating Power.
Proceedings of the 15th International Conference on Computer Modelling and Simulation, 2013

Shearing Speed Stress Comparison between Sn-3.9Ag-0.6Cu and Sn-3.5Ag-0.7Cu Solder Ball.
Proceedings of the 15th International Conference on Computer Modelling and Simulation, 2013

Shear Height Analysis Study on Sn-3.9Ag-0.6Cu by Using SSF Method.
Proceedings of the 15th International Conference on Computer Modelling and Simulation, 2013

Different Shear Height Stress Evaluation on -0.7Cu Based Lead Free Solder.
Proceedings of the 15th International Conference on Computer Modelling and Simulation, 2013

5mm X 5mm Copper-Diamond Composite Slug Stress Evaluation on LED.
Proceedings of the Asia Modelling Symposium 2013, 2013

Shear Ram Speed Analysis for Gold Wire Bond Shear Test.
Proceedings of the Asia Modelling Symposium 2013, 2013


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