Wei-Chih Kuan

According to our database, Wei-Chih Kuan authored at least 1 paper in 2009.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2009

Effect of bump size on current density and temperature distributions in flip-chip solder joints.

Wei-Chih Kuan, S. W. Liang, Chih Chen

Microelectron. Reliab., 2009