William T. Chen

According to our database, William T. Chen authored at least 4 papers between 1964 and 1993.

Collaborative distances:

• no known Dijkstra number.
• no known Erdős number.

1993

Thermal-mechanical strain characterization for printed wiring boards.

Tien Y. Wu, Yifan Guo, William T. Chen

IBM J. Res. Dev., 1993

Solder Ball Connect (SBC) assemblies under thermal loading: I. Deformation measurement via moiré interferometry, and its interpretation.

Yifan Guo, Chun K. Lim, William T. Chen, Charles G. Woychik

IBM J. Res. Dev., 1993

1972

Mechanics of Film Adhesion: Elastic and Elastic-Plastic Behavior.

William T. Chen, T. F. Flavin

IBM J. Res. Dev., 1972

1964

Displacement Discontinuity over a Transversely Isotropic Elastic Half-Space.

William T. Chen

IBM J. Res. Dev., 1964