Y. H. Tian

According to our database1, Y. H. Tian
  • authored at least 2 papers between 2008 and 2011.
  • has a "Dijkstra number"2 of five.

Timeline

Legend:

Book 
In proceedings 
Article 
PhD thesis 
Other 

Links

On csauthors.net:

Bibliography

2011
Reliability and failure analysis of fine copper wire bonds encapsulated with commercial epoxy molding compound.
Microelectronics Reliability, 2011

2008
Growth behavior of Cu/Al intermetallic compounds and cracks in copper ball bonds during isothermal aging.
Microelectronics Reliability, 2008


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