Yanan Tao

According to our database, Yanan Tao authored at least 1 paper in 2024.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2024

Numerical simulation of copper electrodeposition for Through Silicon Via (TSV) with SPS-PEG-Cl additive system.

Yanan Tao, Chao Liang, Ziqi Mei, Zhiqiang Song, Yu Wu, Yunna Sun, Wenqiang Zhang, Yong Ruan, Xiaoguang Zhao

Microelectron. J., February, 2024