Yanwei Dai

Orcid: 0000-0002-2636-772X

According to our database1, Yanwei Dai authored at least 1 paper in 2025.

Collaborative distances:
  • no known Dijkstra number2.
  • no known Erdős number3.

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Bibliography

2025
A Machine Learning Framework for Rapidly Identifying and Predicting Mechanical Properties of Interconnected Layer in SiC Module Considering Surface Metallization Effect Under High-Temperature Aging.
IEEE Trans. Ind. Informatics, November, 2025


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