Yanwei Dai
Orcid: 0000-0002-2636-772X
According to our database1,
Yanwei Dai authored at least 2 papers
between 2025 and 2026.
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Bibliography
2026
Causation-guided mechanism identification and interpretable reduced-order modeling of damage-driving grain-boundary stress in creep.
CoRR, May, 2026
2025
A Machine Learning Framework for Rapidly Identifying and Predicting Mechanical Properties of Interconnected Layer in SiC Module Considering Surface Metallization Effect Under High-Temperature Aging.
IEEE Trans. Ind. Informatics, November, 2025