Yanwei Dai

Orcid: 0000-0002-2636-772X

According to our database1, Yanwei Dai authored at least 2 papers between 2025 and 2026.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of five.

Timeline

Legend:

Book  In proceedings  Article  PhD thesis  Dataset  Other 

Links

On csauthors.net:

Bibliography

2026
Causation-guided mechanism identification and interpretable reduced-order modeling of damage-driving grain-boundary stress in creep.
CoRR, May, 2026

2025
A Machine Learning Framework for Rapidly Identifying and Predicting Mechanical Properties of Interconnected Layer in SiC Module Considering Surface Metallization Effect Under High-Temperature Aging.
IEEE Trans. Ind. Informatics, November, 2025


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