Yi-Ping Wu

According to our database, Yi-Ping Wu authored at least 2 papers between 2012 and 2014.

Collaborative distances:

• Dijkstra number of six.
• Erdős number of four.

2014

Experimental evaluation of SnAgCu solder joint reliability in 100-μm pitch flip-chip assemblies.

Ye Tian, Xi Liu, Justin Chow, Yi-Ping Wu, Suresh K. Sitaraman

Microelectron. Reliab., 2014

2012

A Surveillance System Designed for the Correction of Sitting Posture in Writing.

Yi-Ping Wu, Jun-Horng Chen

Proceedings of the 9th International Conference on Ubiquitous Intelligence and Computing and 9th International Conference on Autonomic and Trusted Computing, 2012