Yii-Der Wu

According to our database, Yii-Der Wu authored at least 3 papers between 2003 and 2008.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2008

Experimental and statistical study in adhesion features of bonded interfaces of IC packages.

Chi-Hui Chien, Thaiping Chen, Wei-Bang Lin, Chi-Chang Hsieh, Yii-Der Wu, Cheng-Hsiu Yeh

Microelectron. Reliab., 2008

2006

Stability of the warpage in a PBGA package subjected to hygro-thermal loading.

Chi-Hui Chien, Thaiping Chen, Yung-Chang Chen, Yii-Tay Chiou, Chi-Chang Hsieh, Yii-Der Wu

Microelectron. Reliab., 2006

2003

Influences of the moisture absorption on PBGA package's warpage during IR reflow process.

Chi-Hui Chien, Yung-Chang Chen, Yii-Tay Chiou, Thaiping Chen, Chi-Chang Hsieh, Jia-Jin Yan, Wei-Zhi Chen, Yii-Der Wu

Microelectron. Reliab., 2003