Zadia Codabux

Orcid: 0000-0001-6715-3341

Affiliations:
  • University of Saskatchewan, Saskatoon, Canada


According to our database1, Zadia Codabux authored at least 26 papers between 2008 and 2023.

Collaborative distances:
  • Dijkstra number2 of four.
  • Erdős number3 of four.

Timeline

Legend:

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Links

Online presence:

On csauthors.net:

Bibliography

2023
Towards a taxonomy of Roxygen documentation in R packages.
Empir. Softw. Eng., July, 2023

MSR4P&S 2022 Workshop Summary.
ACM SIGSOFT Softw. Eng. Notes, January, 2023

Rubbing salt in the wound? A large-scale investigation into the effects of refactoring on security.
Empir. Softw. Eng., 2023

Investigating Software Developers' Challenges for Android Permissions in Stack Overflow.
CoRR, 2023

Integrating Visual Aids to Enhance the Code Reviewer Selection Process.
Proceedings of the IEEE International Conference on Software Maintenance and Evolution, 2023

Exploring Technical Debt in Security Questions on Stack Overflow.
Proceedings of the ACM/IEEE International Symposium on Empirical Software Engineering and Measurement, 2023

2022
analyzeR: A SonarQube plugin for analyzing object-oriented R Packages.
SoftwareX, 2022

Infinite technical debt.
J. Syst. Softw., 2022

Self-admitted technical debt in R: detection and causes.
Autom. Softw. Eng., 2022

Common Programming Mistakes Leading to Information Disclosure: A Preliminary Study.
Proceedings of the IEEE International Conference on Software Analysis, 2022

Toward Understanding the Impact of Refactoring on Program Comprehension.
Proceedings of the IEEE International Conference on Software Analysis, 2022

On the Benefits of the Accelerate Metrics: An Industrial Survey at Vendasta.
Proceedings of the IEEE International Conference on Software Analysis, 2022

An Experience Report on Technical Debt in Pull Requests: Challenges and Lessons Learned.
Proceedings of the ESEM '22: ACM / IEEE International Symposium on Empirical Software Engineering and Measurement, Helsinki, Finland, September 19, 2022

2021
Technical Debt in the Peer-Review Documentation of R Packages: a rOpenSci Case Study.
Proceedings of the 18th IEEE/ACM International Conference on Mining Software Repositories, 2021

A Preliminary Study on Common Programming Mistakes that Lead to Buffer Overflow Vulnerability.
Proceedings of the IEEE 45th Annual Computers, Software, and Applications Conference, 2021

2020
Profiling Developers Through the Lens of Technical Debt.
Proceedings of the ESEM '20: ACM / IEEE International Symposium on Empirical Software Engineering and Measurement, 2020

Examining the Relationship of Code and Architectural Smells with Software Vulnerabilities.
Proceedings of the 27th Asia-Pacific Software Engineering Conference, 2020

2017
An empirical assessment of technical debt practices in industry.
J. Softw. Evol. Process., 2017

The Relationship Between Code Smells and Traceable Patterns - Are They Measuring the Same Thing?
Int. J. Softw. Eng. Knowl. Eng., 2017

The Relationship between Traceable Code Patterns and Code Smells.
Proceedings of the 29th International Conference on Software Engineering and Knowledge Engineering, 2017

2016
Technical debt prioritization using predictive analytics.
Proceedings of the 38th International Conference on Software Engineering, 2016

2015
Trends in empirical research: the report on the 2014 Doctoral Symposium on Empirical Software Engineering.
ACM SIGSOFT Softw. Eng. Notes, 2015

2014
The Correspondence Between Software Quality Models and Technical Debt Estimation Approaches.
Proceedings of the Sixth International Workshop on Managing Technical Debt, 2014

2013
Managing technical debt: an industrial case study.
Proceedings of the 4th International Workshop on Managing Technical Debt, 2013

2012
AES CCMP Algorithm with N-Way Interleaved Cipher Block Chaining
CoRR, 2012

2008
Perfromance of Interleaved Cipher Block Chaining in CCMP.
Proceedings of the Novel Algorithms and Techniques in Telecommunications and Networking, 2008


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