Zilian Qu

According to our database, Zilian Qu authored at least 8 papers between 2018 and 2023.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2023

A Time-Division Multiplexing Multi-Channel Micro-Electrochemical Workstation with Carbon-Based Material Electrodes for Online L-Trosine Detection.

Qiwen Bao, Gang Li, Zhengchun Yang, Jun Wei, Wenbo Cheng, Zilian Qu, Ling Lin

Sensors, July, 2023

High-Precision Resistivity Measurement of Silicon Wafer Under Unstable Lift-Off Distance Using Inductive and Laser Sensors-Integrated Probe.

Zilian Qu, Wensong Wang, Zhengchun Yang, Qiwen Bao, Xueli Li

IEEE Trans. Instrum. Meas., 2023

High-Sensitivity Signal Processing Circuit Integrated Coil Antenna Sensor Toward Measurements of the Water Fraction in the Oil-Water Two-Phase Flow.

Zilian Qu, Qiwen Bao, Zhengchun Yang, Zhenyu Zhao, Qinghai Yang, Shuhui Yang, Zengrui Li, Wensong Wang

IEEE Trans. Instrum. Meas., 2023

2022

High-Precision Thickness Measurement of Cu Film on Si-Based Wafer Using Erasable Printed Eddy Current Coil and High-Sensitivity Associated Circuit Techniques.

Zilian Qu, Wensong Wang, Zhengchun Yang, Qiwen Bao, Yuanjin Zheng

IEEE Trans. Ind. Electron., 2022

2021

Measurement and Error Analysis of Cu Film Thickness With Ta Barrier Layer on Wafer for CMP Application.

Zilian Qu, Wensong Wang, Xueli Li, Qi Li, Yuanjin Zheng

IEEE Trans. Instrum. Meas., 2021

2019

Analysis and Design of Coil-Based Electromagnetic-Induced Thermoacoustic for Rail Internal-Flaw Inspection.

Wensong Wang, Zilian Qu, Zesheng Zheng, Song Yong Phua Kelvin, Ivan Christian, Kye-Yak See, Yuanjin Zheng

IEEE Trans. Intell. Transp. Syst., 2019

Noncontact Thickness Measurement of Cu Film on Silicon Wafer Using Magnetic Resonance Coupling for Stress Free Polishing Application.

Zilian Qu, Wensong Wang, Shuhui Yang, Quqin Sun, Zhongyuan Fang, Yuanjin Zheng

IEEE Access, 2019

2018

Noninvasive Glucose Measurement by Microwave Biosensor with Accuracy Enhancement.

Ruochong Zhang, Zilian Qu, Haoran Jin, Siyu Liu, Yunqi Luo, Yuanjin Zheng

Proceedings of the IEEE International Symposium on Circuits and Systems, 2018