Bo-Jr Huang

According to our database, Bo-Jr Huang authored at least 5 papers between 2021 and 2026.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2026

10.2 A Dynamic Performance Augmentation in a 3nm-Plus Mobile CPU.

Chien-Yu Lu, Bo-Jr Huang, Sung S.-Y. Hsueh, Trong-Hieu Tran, Eric Jia-Wei Fang, Chao-Yang Yeh, Quan Sun, Tao Chen, HsinChen Chen, Huaichung Chang, C.-J. Tsai, Yi-Chang Zhuang, Barry Chen, Ericbill Wang, Hugh Mair, Shih-Arn Hwang

Proceedings of the IEEE International Solid-State Circuits Conference, 2026

2025

8.2: Run-Time Power Management System by on-Die Power Sensor with Silicon Machine Learning-Based Calibration in a 3nm Octa-Core CPU.

Chien-Yu Lu, Bo-Jr Huang, Min-Chieh Chen, Alfred Tsai, Eric Jia-Wei Fang, Yuju Cho, Rex Che-Yuan Liu, Ericbill Wang, You-Ming Tsao, Hugh Mair, Shih-Arn Hwang

Proceedings of the IEEE International Solid-State Circuits Conference, 2025

2024

14.4 A Fully Digital Current Sensor Offering Per-Core Runtime Power for System Budgeting in a 4nm-Plus Octa-Core CPU.

Chien-Yu Lu, Bo-Jr Huang, Min-Chieh Chen, Ollie Tsai, Alfred Tsai, Eric Jia-Wei Fang, Yuju Cho, Harry H. Chen, Ping Kao, Ericbill Wang, Hugh Mair, Shih-Arn Hwang

Proceedings of the IEEE International Solid-State Circuits Conference, 2024

2023

A 5G Mobile Gaming-Centric SoC with High-Performance Thermal Management in 4nm FinFET.

Bo-Jr Huang, Alfred Tsai, Lear Hsieh, Kathleen Chang, C.-J. Tsai, Jia-Ming Chen, Eric Jia-Wei Fang, Sung S.-Y. Hsueh, Jack Ciao, Barry Chen, Chuck Chang, Ping Kao, Ericbill Wang, Harry H. Chen, Hugh Mair, Shih-Arn Hwang

Proceedings of the IEEE International Solid- State Circuits Conference, 2023

2021

35.1 An Octa-Core 2.8/2GHz Dual-Gear Sensor-Assisted High-Speed and Power-Efficient CPU in 7nm FinFET 5G Smartphone SoC.

Bo-Jr Huang, Eric Jia-Wei Fang, Sung S.-Y. Hsueh, Rory Huang, Angus Lin, Chi-Hsun Chiang, Yi-Hsuan Lin, Wen-Wen Hsieh, Barry Chen, Yi-Chang Zhuang, Cheng-Yuh Wu, Jia-Ming Chen, Y. S. Chen, Cheng-Tien Wan, Ericbill Wang, Alex Chiou, Ping Kao, Yuwen Tsai, Harry H. Chen, Shih-Arn Hwang

Proceedings of the IEEE International Solid-State Circuits Conference, 2021