Bo Liu

Orcid: 0000-0002-4331-1541

Affiliations:
  • University of Washington, Global Innovation Exchange, Bellevue, WA, USA


According to our database1, Bo Liu authored at least 12 papers between 2023 and 2026.

Collaborative distances:
  • Dijkstra number2 of four.
  • Erdős number3 of four.

Timeline

Legend:

Book  In proceedings  Article  PhD thesis  Dataset  Other 

Links

Online presence:

On csauthors.net:

Bibliography

2026
Comparing Fabrication Workflows in CAD to Support Design Reasoning.
Proceedings of the 2026 CHI Conference on Human Factors in Computing Systems, 2026

Demonstrating Comparing Fabrication Workflows in CAD to Support Design Reasoning.
Proceedings of the Extended Abstracts of the 2026 CHI Conference on Human Factors in Computing Systems, 2026

2025
THE WASTIVE: An Interactive Ebb and Flow of Digital Fabrication Waste.
CoRR, May, 2025

FlowRing: Integrated Microgesture and Surface Interaction Ring for Versatile XR Input MHCI010.
Proc. ACM Hum. Comput. Interact., 2025

Demonstrating Y-AR: A Mixed Reality CAD Tool for 3D Wire Bending.
Proceedings of the Adjunct Proceedings of the 10th ACM Symposium on Computational Fabrication, 2025

Y-AR: A Mixed Reality CAD Tool for 3D Wire Bending.
Proceedings of the ACM Symposium on Computational Fabrication, 2025

CoPlay: Audio-agnostic Cognitive Scaling for Acoustic Sensing.
Proceedings of the 34th International Conference on Computer Communications and Networks, 2025

Beyond Beautiful: Embroidering Legible and Expressive Tactile Graphics.
Proceedings of the 27th International ACM SIGACCESS Conference on Computers and Accessibility, 2025

2024
Y-AR: A Mixed Reality CAD Tool for 3D Wire Bending.
CoRR, 2024

2023
A differential evolution algorithm with a superior-inferior mutation scheme.
Soft Comput., December, 2023

SmartRecorder: An IMU-based Video Tutorial Creation by Demonstration System for Smartphone Interaction Tasks.
Proceedings of the 28th International Conference on Intelligent User Interfaces, 2023

Lullaland: A Multisensory Virtual Reality Experience to Reduce Stress.
Proceedings of the Extended Abstracts of the 2023 CHI Conference on Human Factors in Computing Systems, 2023


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