Brenda Bai

According to our database, Brenda Bai authored at least 3 papers between 2005 and 2008.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of five.

2008

Non-contact Testing for SoC and RCP (SIPs) at Advanced Nodes.

Brian Moore, Marc Mangrum, Chris Sellathamby, Md. Mahbub Reja, T. Weng, Brenda Bai, Edwin Walter Reid, Igor M. Filanovsky, Steven Slupsky

Proceedings of the 2008 IEEE International Test Conference, 2008

2007

High throughput non-contact SiP testing.

Brian Moore, Chris Sellathamby, Philippe Cauvet, Hérvé Fleury, M. Paulson, Md. Mahbub Reja, Lin Fu, Brenda Bai, Edwin Walter Reid, Igor M. Filanovsky, Steven Slupsky

Proceedings of the 2007 IEEE International Test Conference, 2007

2005

Noncontact wafer probe using wireless probe cards.

Chris Sellathamby, Md. Mahbub Reja, Lin Fu, Brenda Bai, Edwin Walter Reid, Steven Slupsky, Igor M. Filanovsky, Kris Iniewski

Proceedings of the Proceedings 2005 IEEE International Test Conference, 2005