Byunghyun Lee

Affiliations:
  • Samsung Electronics Company Ltd., System LSI Division, Yongin, Korea
  • Seoul National University, Department of electrical engineering and computer science, Seoul, Kore (PhD 2012)


According to our database1, Byunghyun Lee authored at least 3 papers between 2008 and 2014.

Collaborative distances:
  • no known Dijkstra number2.
  • no known Erdős number3.

Timeline

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Links

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Bibliography

2014
Algorithms for TSV resource sharing and optimization in designing 3D stacked ICs.
Integr., 2014

2013
High-level TSV resource sharing and optimization for TSV based 3D IC designs.
Proceedings of the 2013 IEEE International SOC Conference, Erlangen, Germany, 2013

2008
Optimal allocation and placement of thermal sensors for reconfigurable systems and its practical extension.
Proceedings of the 13th Asia South Pacific Design Automation Conference, 2008


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