Changchun Chai

According to our database1, Changchun Chai authored at least 15 papers between 2008 and 2023.

Collaborative distances:
  • Dijkstra number2 of four.
  • Erdős number3 of four.

Timeline

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Bibliography

2023
An Improved MOS Self-Biased Ring Amplifier and Modified Auto-Zeroing Scheme.
IEEE Trans. Very Large Scale Integr. Syst., April, 2023

2022
Two novel PSRR enhancement techniques for voltage reference of depletion NMOS.
IEICE Electron. Express, 2022

2021
An Optimization Method of Carrier Suppression for UHF RFID.
J. Circuits Syst. Comput., 2021

Damage effects and mechanism of GaAs solar cells induced by high-power microwaves.
IEICE Electron. Express, 2021

2020
A high-linearity capacitance-to-digital converter with capacitive offset cancellation technique.
IEICE Electron. Express, 2020

An IAOT controlled current-mode buck converter with RC-based inductor current sensor.
IEICE Electron. Express, 2020

2019
Light-load efficiency improving boost converter with the hybrid modulation of hysteresis current mode and burst mode.
IEICE Electron. Express, 2019

A new method to improve the phase noise performance of the frequency synthesizer for UHF RFID.
IEICE Electron. Express, 2019

Upset and damage mechanisms of the three-dimensional silicon device induced by high power microwave interference.
IEICE Electron. Express, 2019

2016
Ku band damage characteristics of GaAs pHEMT induced by a front-door coupling microwave pulse.
Microelectron. Reliab., 2016

An area-efficient and high speed multiplexer for battery monitor system.
IEICE Electron. Express, 2016

2015
Analysis of high power microwave induced degradation and damage effects in AlGaAs/InGaAs pHEMTs.
Microelectron. Reliab., 2015

Modeling and understanding of the frequency dependent HPM upset susceptibility of the CMOS inverter.
Sci. China Inf. Sci., 2015

2012
Target Tracking Approximation Algorithms with Particle Filter Optimization and Fault-Tolerant Analysis in Wireless Sensor Networks.
J. Networks, 2012

2008
Temperature-dependent stress-induced voiding in dual-damascene Cu interconnects.
Microelectron. Reliab., 2008


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