Yintang Yang
According to our database1,
Yintang Yang
authored at least 229 papers
between 2004 and 2021.
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Bibliography
2021
Cloud-based RFID mutual authentication scheme for efficient privacy preserving in IoV.
J. Frankl. Inst., 2021
2020
A Secure and Verifiable Data Sharing Scheme Based on Blockchain in Vehicular Social Networks.
IEEE Trans. Veh. Technol., 2020
Ultrawideband Power-Switchable Transmitter With 17.7-dBm Output Power for See-Through-Wall Radar.
IEEE Trans. Very Large Scale Integr. Syst., 2020
SRNoC: An Ultra-Fast Configurable FPGA-Based NoC Simulator Using Switch-Router Architecture.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2020
High Resolution ADC for Ultrasound Color Doppler Imaging Based on MASH Sigma-Delta Modulator.
IEEE Trans. Biomed. Eng., 2020
A dynamic and verifiable multi-keyword ranked search scheme in the P2P networking environment.
Peer Peer Netw. Appl., 2020
Microelectron. J., 2020
IEEE J. Solid State Circuits, 2020
A secure and efficient outsourced computation on data sharing scheme for privacy computing.
J. Parallel Distributed Comput., 2020
A 20-MHz BW MASH Sigma-Delta Modulator with Mismatch Noise Randomization for Multi-Bit DACs.
J. Circuits Syst. Comput., 2020
Inf. Sci., 2020
Network-on-chip heuristic mapping algorithm based on isomorphism elimination for NoC optimisation.
IET Comput. Digit. Tech., 2020
An optimized fully-passive noise-shaping SAR ADC with integration capacitor reuse technique.
IEICE Electron. Express, 2020
A high-linearity capacitance-to-digital converter with capacitive offset cancellation technique.
IEICE Electron. Express, 2020
An IAOT controlled current-mode buck converter with RC-based inductor current sensor.
IEICE Electronic Express, 2020
A Collaborative Auditing Blockchain for Trustworthy Data Integrity in Cloud Storage System.
IEEE Access, 2020
2019
TAONoC: A Regular Passive Optical Network-on-Chip Architecture Based on Comb Switches.
IEEE Trans. Very Large Scale Integr. Syst., 2019
IEEE Trans. Circuits Syst. II Express Briefs, 2019
A 1.2-V 2.41-GHz Three-Stage CMOS OTA With Efficient Frequency Compensation Technique.
IEEE Trans. Circuits Syst. I Regul. Pap., 2019
A 10-Bit 600-MS/s Time-Interleaved SAR ADC With Interpolation-Based Timing Skew Calibration.
IEEE Trans. Circuits Syst. II Express Briefs, 2019
Thermal-Aware Modeling and Analysis for a Power Distribution Network Including Through-Silicon-Vias in 3-D ICs.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2019
Permutation Matrix Encryption Based Ultralightweight Secure RFID Scheme in Internet of Vehicles.
Sensors, 2019
Opt. Switch. Netw., 2019
IEEE Netw., 2019
Electromagnetic modeling and analysis of the tapered differential through glass vias.
Microelectron. J., 2019
Microelectron. J., 2019
A high linear voltage-to-time converter (VTC) with 1.2 V input range for time-domain analog-to-digital converters.
Microelectron. J., 2019
A 6-bit digital CMOS variable gain attenuator with large dynamic range and high linearity-in-dB for ultrasound imaging applications.
Microelectron. J., 2019
A 15ps resolution time-to-digital converter with on-chip PLL counting for LiDAR multi-object sensors.
Microelectron. J., 2019
Mismatch errors randomization for multi-bit DAC in sigma-delta modulators based on butterfly-type network.
Microelectron. J., 2019
J. Circuits Syst. Comput., 2019
A 15-MHz bandwidth double sampling MASH25b-15b sigma-delta modulator with DEM for multibit DACs.
Int. J. Circuit Theory Appl., 2019
A large dynamic range voltage controlled attenuator with improved linearity-in-dB for ultrasound applications.
Int. J. Circuit Theory Appl., 2019
IEICE Electron. Express, 2019
Light-load efficiency improving boost converter with the hybrid modulation of hysteresis current mode and burst mode.
IEICE Electron. Express, 2019
Upset and damage mechanisms of the three-dimensional silicon device induced by high power microwave interference.
IEICE Electron. Express, 2019
Future Gener. Comput. Syst., 2019
Future Gener. Comput. Syst., 2019
An Efficient Multi-Message and Multi-Receiver Signcryption Scheme for Heterogeneous Smart Mobile IoT.
IEEE Access, 2019
IEEE Access, 2019
Proceedings of the 2019 IEEE International Conference on Communications, 2019
A 7b 2.6mW 900MS/s Nonbinary 2-then-3b/cycle SAR ADC with Background Offset Calibration.
Proceedings of the IEEE Custom Integrated Circuits Conference, 2019
2018
H<sup>2</sup>OEIN: A Hierarchical Hybrid Optical/Electrical Interconnection Network for Exascale Computing Systems.
IEEE Trans. Multi Scale Comput. Syst., 2018
IEEE Trans. Ind. Informatics, 2018
IEEE Trans. Circuits Syst. I Regul. Pap., 2018
IEEE Trans. Circuits Syst. II Express Briefs, 2018
EARS-DM: Efficient Auto Correction Retrieval Scheme for Data Management in Edge Computing.
Sensors, 2018
Peer Peer Netw. Appl., 2018
Secure ultra-lightweight RFID mutual authentication protocol based on transparent computing for IoV.
Peer Peer Netw. Appl., 2018
Peer Peer Netw. Appl., 2018
Secure and Efficient Privacy-Preserving Ciphertext Retrieval in Connected Vehicular Cloud Computing.
IEEE Netw., 2018
Low power and reliable interconnection with combination of Crosstalk Avoidance Green Coding and capacitively charge-sharing transmitter for network-on-chip.
Microelectron. J., 2018
A 1.2 V, 3.0 ppm/°C, 3.6 μA CMOS bandgap reference with novel 3-order curvature compensation.
Microelectron. J., 2018
A dual mode step-down switched-capacitor DC-DC converter with adaptive switch width modulation.
Microelectron. J., 2018
J. Medical Syst., 2018
A Power-Enhanced Active Rectifier with Offset-Controlled Comparator for Self-Powered PEH Systems.
J. Circuits Syst. Comput., 2018
Adaptive On-Time-Controlled PFM Boost Converter with a Below-Threshold Startup Voltage.
J. Circuits Syst. Comput., 2018
Unified multi-objective mapping for network-on-chip using genetic-based hyper-heuristic algorithms.
IET Comput. Digit. Tech., 2018
Effectiveness of the layout approach in mitigating single event transients in 65-nm bulk CMOS process.
IEICE Electron. Express, 2018
An intelligent partitioning approach of the system-on-chip for flexible and stretchable systems.
Sci. China Inf. Sci., 2018
Sci. China Inf. Sci., 2018
A stretchable flexible electronic platform for mechanical and electrical collaborative design.
Sci. China Inf. Sci., 2018
IEEE Access, 2018
A Multi-Objective Architecture Optimization Method for Application-Specific Noc Design.
Proceedings of the 31st IEEE International System-on-Chip Conference, 2018
Proceedings of the IEEE International Conference on Internet of Things (iThings) and IEEE Green Computing and Communications (GreenCom) and IEEE Cyber, 2018
Proceedings of the 2018 IEEE International Conference on Edge Computing, 2018
Inductance of Different Profiles of Through Glass Vias based on magnetic flux density.
Proceedings of the 2018 IEEE Asia Pacific Conference on Circuits and Systems, 2018
A Background Timing Skew Calibration Technique in Time-Interleaved ADCs With Second Order Compensation.
Proceedings of the 2018 IEEE Asia Pacific Conference on Circuits and Systems, 2018
2017
IEEE Trans. Circuits Syst. II Express Briefs, 2017
Sensors, 2017
Secur. Commun. Networks, 2017
Pers. Ubiquitous Comput., 2017
Peer Peer Netw. Appl., 2017
System-level modeling and performance evaluation of multistage optical network on chips (MONoCs).
Photonic Netw. Commun., 2017
Microelectron. J., 2017
Universal closed-form expression based on magnetic flux density for the inductance of Tapered Through-Silicon Vias (T-TSVs).
Microelectron. J., 2017
Microelectron. J., 2017
Microelectron. J., 2017
A high accuracy CMOS subthreshold voltage reference with offset cancellation and thermal compensation.
Microelectron. J., 2017
ULMAP: Ultralightweight NFC Mutual Authentication Protocol with Pseudonyms in the Tag for IoT in 5G.
Mob. Inf. Syst., 2017
J. Syst. Archit., 2017
A Near-Threshold Voltage Startup Monolithic Boost Converter with Adaptive Sleeping Time Control.
J. Circuits Syst. Comput., 2017
A Novel Interface Circuit with 99.2% MPPT Accuracy and 1.3% THD for Energy Harvesting.
J. Circuits Syst. Comput., 2017
IEICE Electron. Express, 2017
A Study of PN Junction Diffusion Capacitance of MOSFET in Presence of Single Event Transient.
J. Electron. Test., 2017
Circuits Syst. Signal Process., 2017
A Fast-Settling Three-Stage Amplifier Using Regular Miller Plus Reversed Indirect Compensation.
Circuits Syst. Signal Process., 2017
Proceedings of the 2017 IEEE Global Communications Conference, 2017
Proceedings of the Second IEEE International Conference on Data Science in Cyberspace, 2017
Proceedings of the ACM Turing 50th Celebration Conference, 2017
2016
A Highly Scalable Optical Network-on-Chip With Small Network Diameter and Deadlock Freedom.
IEEE Trans. Very Large Scale Integr. Syst., 2016
Lightweight and ultralightweight RFID mutual authentication protocol with cache in the reader for IoT in 5G.
Secur. Commun. Networks, 2016
Photonic Netw. Commun., 2016
Ku band damage characteristics of GaAs pHEMT induced by a front-door coupling microwave pulse.
Microelectron. Reliab., 2016
Microelectron. J., 2016
Design of a fully integrated receiver analog baseband chain for 2.4-GHz ZigBee applications.
Microelectron. J., 2016
Analysis of propagation delay and repeater insertion in single-walled carbon nanotube bundle interconnects.
Microelectron. J., 2016
Microelectron. J., 2016
DRTL: A heat-balanced deadlock-free routing algorithm for 3D topology network-on-chip.
Microprocess. Microsystems, 2016
Antenna-in-package system integrated with meander line antenna based on LTCC technology.
Frontiers Inf. Technol. Electron. Eng., 2016
A 10-GS/s 6-Bit Track-and-Hold Amplifier for Time-Interleaved SAR ADCs in 65-nm CMOS.
J. Circuits Syst. Comput., 2016
A High Efficiency Self-Powered Rectifier for Piezoelectric Energy Harvesting Systems.
J. Circuits Syst. Comput., 2016
J. Circuits Syst. Comput., 2016
J. Circuits Syst. Comput., 2016
A large dynamic-range, high dB-linearity VGA using switch arrays and second-order mismatch-shaping DEM technique.
Int. J. Circuit Theory Appl., 2016
IEICE Electron. Express, 2016
New coaxial through silicon via (TSV) applied for three dimensional integrated circuits (3D ICs).
IEICE Electron. Express, 2016
Universal method for designing non-blocking multicast-supported on chip optical router.
IEICE Electron. Express, 2016
Universal closed-form expressions for the inductance of tapered through silicon vias (T-TSVs) based on vector magnetic potential.
IEICE Electron. Express, 2016
An IM2-free floating current buffer using average power based automatic calibration for IEEE 802.15.6 transmitter.
IEICE Electron. Express, 2016
IEICE Electron. Express, 2016
RingCube - An incrementally scale-out optical interconnect for cloud computing data center.
Future Gener. Comput. Syst., 2016
Circuits Syst. Signal Process., 2016
An adaptive partition-based multicast routing scheme for mesh-based Networks-on-Chip.
Comput. Electr. Eng., 2016
Proceedings of the Wireless Algorithms, Systems, and Applications, 2016
Proceedings of the 2016 IEEE/CIC International Conference on Communications in China, 2016
Proceedings of the 2016 IEEE Global Communications Conference, 2016
Proceedings of the IEEE Biomedical Circuits and Systems Conference, 2016
2015
IEEE Trans. Very Large Scale Integr. Syst., 2015
IEEE Trans. Circuits Syst. II Express Briefs, 2015
Analysis of high power microwave induced degradation and damage effects in AlGaAs/InGaAs pHEMTs.
Microelectron. Reliab., 2015
Microelectron. J., 2015
A 5-GHz LC VCO with digital AAC and AFBS for 2.4 GHz ZigBee transceiver applications.
Microelectron. J., 2015
A low-distortion multi-bit sigma-delta ADC with mismatch-shaping DACs for WLAN applications.
Microelectron. J., 2015
A background digital calibration of split-capacitor 16-bit SAR ADC with sub-binary architecture.
Microelectron. J., 2015
A Multi-Output on-Chip Switched-Capacitor DC-DC Converter with Unequal Flying Capacitors for Different Power Modes.
J. Circuits Syst. Comput., 2015
J. Circuits Syst. Comput., 2015
J. Circuits Syst. Comput., 2015
J. Circuits Syst. Comput., 2015
J. Circuits Syst. Comput., 2015
J. Circuits Syst. Comput., 2015
Int. J. Distributed Sens. Networks, 2015
IEICE Electron. Express, 2015
Analysis and evaluation of coupling between adjacent TSVs with considering the discharging path.
IEICE Electron. Express, 2015
Variable resolution SAR ADC architecture with 99.6% reduction in switching energy over conventional scheme.
IEICE Electron. Express, 2015
Effects of coaxial through-silicon via on carrier mobility along [100] and [110] crystal directions of (100) silicon.
IEICE Electron. Express, 2015
IEICE Electron. Express, 2015
An ultra-low-voltage self-powered energy harvesting rectifier with digital switch control.
IEICE Electron. Express, 2015
Modeling and understanding of the frequency dependent HPM upset susceptibility of the CMOS inverter.
Sci. China Inf. Sci., 2015
Proceedings of the Wireless Algorithms, Systems, and Applications, 2015
Proceedings of the 2015 IEEE TrustCom/BigDataSE/ISPA, 2015
Proceedings of the 2015 IEEE Global Communications Conference, 2015
Proceedings of the IEEE 2nd International Conference on Cyber Security and Cloud Computing, 2015
Proceedings of the IEEE Asian Solid-State Circuits Conference, 2015
A voltage doubling AC-DC converter with offset-controlled comparators for piezoelectric energy harvester.
Proceedings of the 2015 IEEE 11th International Conference on ASIC, 2015
2014
Novel Universal Multistable Mechanism Based on Magnetic-Mechanical-Inertial Coupling Effects.
IEEE Trans. Ind. Electron., 2014
IEEE Trans. Circuits Syst. II Express Briefs, 2014
A 2.1-Channel Class-D Amplifier Exploited Coupling Virtual-Audio-Image to Enhance Stereo.
IEEE Trans. Circuits Syst. II Express Briefs, 2014
A single-channel 8-bit 660 MS/s asynchronous SAR ADC with pre-settling procedure in 65 nm CMOS.
Microelectron. J., 2014
Microelectron. J., 2014
A fully integrated feedback AGC loop for ZigBee (IEEE 802.15.4) RF transceiver applications.
Microelectron. J., 2014
J. Circuits Syst. Comput., 2014
Design of a Fully Integrated 2.4 GHz frequency PLL synthesizer for ZigBee Transceiver Application.
J. Circuits Syst. Comput., 2014
A 2.67 fJ/c.-s. 27.8 kS/s 0.35 V 10-bit successive approximation register analogue-to-digital converter in 65 nm complementary metal oxide semiconductor.
IET Circuits Devices Syst., 2014
RONoC: A Reconfigurable Architecture for Application-Specific Optical Network-on-Chip.
IEICE Trans. Inf. Syst., 2014
IEICE Electron. Express, 2014
Temperature properties of the parasitic resistance of through-silicon vias (TSVs) in high-frequency 3-D ICs.
IEICE Electron. Express, 2014
IEICE Electron. Express, 2014
IEICE Electron. Express, 2014
IEICE Electron. Express, 2014
IEICE Electron. Express, 2014
Concurr. Comput. Pract. Exp., 2014
IEEE Comput. Archit. Lett., 2014
A multi-output on-chip switched-capacitor DC-DC converter for near- and sub-threshold power modes.
Proceedings of the IEEE International Symposium on Circuits and Systemss, 2014
Proceedings of the IEEE Biomedical Circuits and Systems Conference, 2014
LRMAPC: A Lightweight RFID Mutual Authentication Protocol with Cache in the Reader for IoT.
Proceedings of the 14th IEEE International Conference on Computer and Information Technology, 2014
2013
A 1.33 μW 10-bit 200KS/s SAR ADC with a tri-level based capacitor switching procedure.
Microelectron. J., 2013
Two-dimensional electrical modeling of thermoelectric devices considering temperature-dependent parameters under the condition of nonuniform substrate temperature distribution.
Microelectron. J., 2013
Microelectron. J., 2013
J. Circuits Syst. Comput., 2013
J. Circuits Syst. Comput., 2013
IEICE Trans. Inf. Syst., 2013
IEICE Electron. Express, 2013
IEICE Electron. Express, 2013
Thermo-mechanical performance of Cu and SiO<sub>2</sub> filled coaxial through-silicon-via (TSV).
IEICE Electron. Express, 2013
Analytical models for the thermal strain and stress induced by annular through-silicon-via (TSV).
IEICE Electron. Express, 2013
Reduction of signal reflection in high-frequency three-dimensional (3D) integration circuits.
IEICE Electron. Express, 2013
IEICE Electron. Express, 2013
IEICE Electron. Express, 2013
Comput. Electr. Eng., 2013
Proceedings of the 2013 5th International Conference on Intelligent Networking and Collaborative Systems, 2013
2012
Through-silicon-via insertion for performance optimization in three-dimensional integrated circuits.
Microelectron. J., 2012
Target Tracking Approximation Algorithms with Particle Filter Optimization and Fault-Tolerant Analysis in Wireless Sensor Networks.
J. Networks, 2012
J. Circuits Syst. Comput., 2012
IEICE Electron. Express, 2012
IEICE Electron. Express, 2012
IEICE Electron. Express, 2012
IEICE Electron. Express, 2012
IEICE Electron. Express, 2012
Sci. China Inf. Sci., 2012
Comput. Electr. Eng., 2012
ESLRAS: A Lightweight RFID Authentication Scheme with High Efficiency and Strong Security for Internet of Things.
Proceedings of the 2012 Fourth International Conference on Intelligent Networking and Collaborative Systems, 2012
Proceedings of the 2012 1st IEEE International Conference on Communications in China (ICCC), 2012
2011
Novel hybrid D/A structures for high-resolution SAR ADCs - analysis, modeling and realization.
Microelectron. J., 2011
Strain coefficient measurement for the (100) uniaxial strain silicon by Raman spectroscopy.
Sci. China Inf. Sci., 2011
An Efficient Bee Behavior-Based Multi-function Routing Algorithm for Network-on-Chip.
Proceedings of the Advances in Swarm Intelligence - Second International Conference, 2011
A high-speed asynchronous array multiplier based on multi-threshold semi-static NULL convention logic pipeline.
Proceedings of the 2011 IEEE 9th International Conference on ASIC, 2011
A thermal model for the top layer of 3D integrated circuits considering through silicon vias.
Proceedings of the 2011 IEEE 9th International Conference on ASIC, 2011
Proceedings of the 2011 IEEE 9th International Conference on ASIC, 2011
Proceedings of the 2011 IEEE 9th International Conference on ASIC, 2011
Proceedings of the 2011 IEEE 9th International Conference on ASIC, 2011
A low-kickback preamplifier with offset cancellation for pipelined folding A/D Converter.
Proceedings of the 2011 IEEE 9th International Conference on ASIC, 2011
A 1.8V 100MS/s 10-bit pipelined folding A/D converter with 9.49 ENOB at Nyquist frequency.
Proceedings of the 2011 IEEE 9th International Conference on ASIC, 2011
2010
Design of a low power GPS receiver in 0.18 µm CMOS technology with a SigmaDeltafractional-N synthesizer.
J. Zhejiang Univ. Sci. C, 2010
High Speed Multi-Resource Arbiter with Active Virtual Channel Allocation for Network on Chips.
J. Circuits Syst. Comput., 2010
Proceedings of the 2010 International Conference on Machine Vision and Human-machine Interface, 2010
Proceedings of the Sixth International Conference on Natural Computation, 2010
Proceedings of the 2010 Asia-Pacific Conference on Wearable Computing Systems, 2010
2009
Proceedings of the 2009 Pacific-Asia Conference on Circuits, Communications and Systems, 2009
A Novel R-C Combination Based Pseudo-differential SAR A/D Converter in 90nm CMOS Process.
Proceedings of the 2009 Pacific-Asia Conference on Circuits, Communications and Systems, 2009
Proceedings of the 2009 Pacific-Asia Conference on Circuits, Communications and Systems, 2009
Proceedings of the 2009 Pacific-Asia Conference on Circuits, Communications and Systems, 2009
Proceedings of the 2009 Pacific-Asia Conference on Circuits, Communications and Systems, 2009
2008
Microelectron. Reliab., 2008
2005
A High Accuracy Bandgap Reference with Chopped Modulator to Compensate MOSFET Mismatch.
Proceedings of the 18th International Conference on VLSI Design (VLSI Design 2005), 2005
Analysis of the Effect of LUT Size on FPGA Area and Delay Using Theoretical Derivations.
Proceedings of the 6th International Symposium on Quality of Electronic Design (ISQED 2005), 2005
Proceedings of the 6th International Symposium on Quality of Electronic Design (ISQED 2005), 2005
2004
Microelectron. Reliab., 2004