Chih-Ming Chen

Orcid: 0000-0003-4481-1094

Affiliations:
  • National Chung Hsing University, Department of Chemical Engineering, Taiwan


According to our database1, Chih-Ming Chen authored at least 6 papers between 2012 and 2016.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

Legend:

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Bibliography

2016
Microstructural and thermal characterizations of light-emitting diode employing a low-temperature die-bonding material.
Microelectron. Reliab., 2016

2014
Interfacial reactions of Sn-58Bi and Sn-0.7Cu lead-free solders with Alloy 42 substrate.
Microelectron. Reliab., 2014

Planar copper-tin inter-metallic film formation on strained substrates.
Microelectron. Reliab., 2014

Effect of polyimide baking on bump resistance in flip-chip solder joints.
Microelectron. Reliab., 2014

2012
Improvement of thermal management of high-power GaN-based light-emitting diodes.
Microelectron. Reliab., 2012

Solid-state interfacial reactions at the solder joints employing Au/Pd/Ni and Au/Ni as the surface finish metallizations.
Microelectron. Reliab., 2012


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