Chiyen Kim

According to our database, Chiyen Kim authored at least 2 papers between 2015 and 2017.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2017

3D Printed Electronics With High Performance, Multi-Layered Electrical Interconnect.

Chiyen Kim, David Espalin, Min Liang, Hao Xin, Alejandro Cuaron, Issac Varela, Eric W. MacDonald, Ryan B. Wicker

IEEE Access, 2017

2015

A study to detect a material deposition status in fused deposition modeling technology.

Chiyen Kim, David Espalin, Alejandro Cuaron, Mireya A. Perez, Eric W. MacDonald, Ryan B. Wicker

Proceedings of the IEEE International Conference on Advanced Intelligent Mechatronics, 2015