Choong-Un Kim

According to our database¹, Choong-Un Kim authored at least 3 papers between 2020 and 2023.

Collaborative distances:

Dijkstra number² of five.
Erdős number³ of four.

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Bibliography

2023

Advanced Methods of Detecting Physical Damages in Packaging and BEOL Interconnects.

[BibT_eX]

[DOI]

Proceedings of the IEEE International Reliability Physics Symposium, 2023

2021

Mechanisms of Contact Formation and Electromigration Reliability in Wirebond Packages.

[BibT_eX]

[DOI]

Proceedings of the IEEE International Reliability Physics Symposium, 2021

2020

Effects of UBM Thickness and Current Flow Configuration on Electromigration Failure Mechanisms in Solder Interconnects.

[BibT_eX]

[DOI]

Proceedings of the 2020 IEEE International Reliability Physics Symposium, 2020

Choong-Un Kim

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