Chunyue Huang

According to our database, Chunyue Huang authored at least 8 papers between 2024 and 2026.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2026

Investigation of the mechanical properties and construction of an Arrhenius-type constitutive model for SnBiInZn high-entropy alloy solder.

Gui Wang, Chunyue Huang, Yonglin Chen, Jinmei Yang, Ying Lu

Microelectron. J., 2026

Torsional stress analysis and optimization of SOP solder joints using SnBiInZn high-entropy alloy solder.

Gui Wang, Chunyue Huang, Dian Chen, Jishen Wei, Chao Gao

Microelectron. J., 2026

Analysis and optimization of bending vibration mechanical properties of underfill BGA solder joints.

Junjian Li, Long Huang, Chunyue Huang, Ying Lu, Gui Wang

Microelectron. J., 2026

Analysis of the impact of structural parameters on natural frequency, random vibration stress, and bending stress in stacked BGA solder joints based on orthogonal experimental design.

Dian Chen, Chunyue Huang, Jingcheng Mo, Chao Gao, Gui Wang

Microelectron. J., 2026

2025

Stress analysis and optimization of QFN solder joints under bending-torsion coupled conditions based on the SSA.

Jisheng Wei, Chunyue Huang, Chao Gao, Gui Wang

Microelectron. J., 2025

Analysis and prediction of bending-torsion coupled stress in BGA stacked solder joints considering interaction effects.

Jingcheng Mo, Chunyue Huang, Chao Gao, Gui Wang

Microelectron. J., 2025

Reliability analysis of PoP stacked solder joints under thermal cycling load based on the optimal equivalent model.

Chao Gao, Chunyue Huang, Ying Liang, Gui Wang, Yongling Chen

Microelectron. J., 2025

2024

The Impact of Short Video Live Broadcast on the Sales of Sports Machinery and Equipment.

Chunyue Huang, Lichun Chen

Int. J. e Collab., 2024