Jingcheng Mo

According to our database¹, Jingcheng Mo authored at least 2 papers between 2025 and 2026.

Collaborative distances:

Dijkstra number² of five.
Erdős number³ of five.

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Bibliography

2026

Analysis of the impact of structural parameters on natural frequency, random vibration stress, and bending stress in stacked BGA solder joints based on orthogonal experimental design.

[BibT_eX]

[DOI]

Microelectron. J., 2026

2025

Analysis and prediction of bending-torsion coupled stress in BGA stacked solder joints considering interaction effects.

[BibT_eX]

[DOI]

Microelectron. J., 2025

Jingcheng Mo

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Bibliography

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