Craig R. Yeakle

According to our database1, Craig R. Yeakle authored at least 1 paper in 2013.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

Legend:

Book 
In proceedings 
Article 
PhD thesis 
Other 

Links

On csauthors.net:

Bibliography

2013
Cost-effective temporary bonding and debonding material solution towards high-volume manufacturing 2.5D/3D through-silicon via integrated circuits.
Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013


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