According to our database1, Yann Civale authored at least 4 papers between 2009 and 2013.
Legend:Book In proceedings Article PhD thesis Other
Cost-effective temporary bonding and debonding material solution towards high-volume manufacturing 2.5D/3D through-silicon via integrated circuits.
Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013
3D chip package interaction thermo-mechanical challenges: Proximity effects of Through Silicon vias and μ-bumps.
Proceedings of the IEEE International Conference on IC Design & Technology, 2012
Proceedings of the IEEE International Conference on 3D System Integration, 2010
Die stacking using 3D-wafer level packaging copper/polymer through-si via technology and Cu/Sn interconnect bumping.
Proceedings of the IEEE International Conference on 3D System Integration, 2009