Yann Civale

According to our database1, Yann Civale authored at least 4 papers between 2009 and 2013.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

Legend:

Book 
In proceedings 
Article 
PhD thesis 
Other 

Links

On csauthors.net:

Bibliography

2013
Cost-effective temporary bonding and debonding material solution towards high-volume manufacturing 2.5D/3D through-silicon via integrated circuits.
Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

2012
3D chip package interaction thermo-mechanical challenges: Proximity effects of Through Silicon vias and μ-bumps.
Proceedings of the IEEE International Conference on IC Design & Technology, 2012

2010
A novel concept for ultra-low capacitance via-last TSV.
Proceedings of the IEEE International Conference on 3D System Integration, 2010

2009
Die stacking using 3D-wafer level packaging copper/polymer through-si via technology and Cu/Sn interconnect bumping.
Proceedings of the IEEE International Conference on 3D System Integration, 2009


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