Daniel Mermin
According to our database1,
Daniel Mermin
authored at least 2 papers
between 2024 and 2025.
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Bibliography
2025
IEEE Trans. Haptics, 2025
2024
Hybrid Integration of 3D-RF Interconnects on AlGaN/GaN/Si HEMT RF Transistor featuring 2.2W/mm Psat & 41% PAE @28GHz using a Robust and Cost-Effective Chiplet Heterogeneous Bonding Technique.
Proceedings of the IEEE Symposium on VLSI Technology and Circuits 2024, 2024