Christophe Dubarry

According to our database, Christophe Dubarry authored at least 4 papers between 2019 and 2024.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2024

Hybrid Integration of 3D-RF Interconnects on AlGaN/GaN/Si HEMT RF Transistor featuring 2.2W/mm Psat & 41% PAE @28GHz using a Robust and Cost-Effective Chiplet Heterogeneous Bonding Technique.

A. Divay, Olivier Valorge, Christophe Dubarry, M. Medbouhi, Rémi Franiatte, Daniel Mermin, R. Velard, Y. Gobil, F. Morisot, Erwan Morvan, Ismael Charlet, Luca Lucci, J. Lugo, Xavier Garros

Proceedings of the IEEE Symposium on VLSI Technology and Circuits 2024, 2024

Die-to-Wafer Hybrid Bonding Impact at MM-Wave Frequencies.

Mohammad Alsukour, Olivier Valorge, Margot Faure, Loïc Vincent, Victor Milon, Pascal Chevalier, Emmanuel Pistono, Jean-Daniel Arnould, Christophe Dubarry

Proceedings of the International 3D Systems Integration Conference, 2024

2021

3D interconnection using copper direct hybrid bonding for GaN on silicon wafer.

Christophe Dubarry, Lucile Arnaud, Maria-Luisa Calvo-Muñoz, Gaëlle Mauguen, Stéphane Moreau, R. Crochemore, Nicolas Bresson, Bernard Aventurier

Proceedings of the IEEE International 3D Systems Integration Conference, 2021

2019

Towards a Complete Direct Hybrid Bonding D2W Integration Flow: Known-Good-Dies and Die Planarization Modules Development.

Emilie Bourjot, Paul Stewart, Christophe Dubarry, E. Lagoutte, E. Rolland, Nicolas Bresson, G. Romano, D. Scevola, Viorel Balan, Jérôme Dechamp, Marc Zussy, Gaëlle Mauguen, Clément Castan, Loïc Sanchez, Amadine Jouve, Frank Fournel, Séverine Cheramy

Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019