Daohong Yang
Orcid: 0009-0008-8052-6139
According to our database1,
Daohong Yang authored at least 2 papers
between 2023 and 2026.
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Bibliography
2026
Deep trench capacitor embedded in 3D-IC multi-wafer hybrid bonding package for power delivery network optimization.
Microelectron. J., 2026
2023
Proceedings of the 2023 International Conference on Advances in Artificial Intelligence and Applications, 2023