Qiong Zhan

According to our database, Qiong Zhan authored at least 2 papers between 2023 and 2026.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2026

Deep trench capacitor embedded in 3D-IC multi-wafer hybrid bonding package for power delivery network optimization.

Sheng Hu, Huajun Sun, Jun Zhou, Qiong Zhan, Peng Sun, Beibei Sheng, Peng Zhu, Changtian Cao, Daohong Yang, Xiangshui Miao

Microelectron. J., 2026

2023

A 135 GBps/Gbit 0.66 pJ/bit Stacked Embedded DRAM with Multilayer Arrays by Fine Pitch Hybrid Bonding and Mini-TSV.

Song Wang, Bing Yu, Wenwu Xiao, Fujun Bai, Xiaodong Long, Liang Bai, Xuerong Jia, Fengguo Zuo, Jie Tan, Yixin Guo, Peng Sun, Jun Zhou, Qiong Zhan, Sheng Hu, Yu Zhou, Yi Kang, Qiwei Ren, Xiping Jiang

Proceedings of the 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), 2023