Dave Martini

According to our database, Dave Martini authored at least 2 papers in 2016.

Collaborative distances:

• Dijkstra number of six.
• Erdős number of five.

2016

Front-side mid-level Tungsten TSV integration for high-density 3D applications.

Brian Mattis, Lovelace Soirez, Catherine Bullock, Dave Martini, Sara Jensen, James Levy, Adam Jones

Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016

High density backside tungsten TSV for 3D stacked ICs.

Reynard Blasa, Brian Mattis, Dave Martini, Sidi Lanee, Carl Petteway, Sangki Hong, Kangsoo Yi

Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016