De-Shin Liu

According to our database, De-Shin Liu authored at least 7 papers between 2002 and 2020.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2020

Bifurcation Analysis of Gear Pair with Continuous and Intermittent Mesh Stiffness Using Enhanced Compliance Method.

De-Shin Liu, Chuen-Ren Wang, Ting-Nung Shiau, Kuo-Hsuan Huang, Wei-Chun Hsu

Int. J. Bifurc. Chaos, 2020

2010

Modeling of multi-layered structure containing heterogeneous material layer with randomly distributed particles using infinite element method.

De-Shin Liu, Zhen-Wei Zhuang, Ching-Yang Chen, Cho-Liang Chung

Microelectron. Reliab., 2010

Novel analysis model for investigation of contact force and scrub length for design of probe card.

De-Shin Liu, Chi-Min Chang, John Liu, Shu-Ching Ho, Hao-Yin Tsai

Microelectron. Reliab., 2010

2006

Design of a novel chip on glass package solution for CMOS image sensor device.

Ching-Yang Chen, Yung-Ching Chao, De-Shin Liu, Zhen-Wei Zhuang

Microelectron. Reliab., 2006

2002

Procedure for design optimization of a T-cap flip chip package.

Chin-Yu Ni, De-Shin Liu, Ching-Yang Chen

Microelectron. Reliab., 2002

The optimization design of bump interconnections in flip chip packages from the electrical standpoint.

De-Shin Liu, Chin-Yu Ni

Microelectron. Reliab., 2002

A thermo-mechanical study on the electrical resistance of aluminum wire conductors.

De-Shin Liu, Chin-Yu Ni

Microelectron. Reliab., 2002