Deguang Yang

According to our database, Deguang Yang authored at least 6 papers between 2024 and 2025.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2025

Transmission Channel and Matching Network Design Strategies in Chiplet-Based 2.5-D ICs for RF Applications.

Changle Zhi, Gang Dong, Deguang Yang, Xin Luo, Junpeng Yao, Daihang Liu, Zhangming Zhu

IEEE Internet Things J., September, 2025

Electrical and Thermal Characteristics Optimization in Interposer-Based 2.5-D Integrated Circuits.

Changle Zhi, Gang Dong, Deguang Yang, Daihang Liu, Yinghao Feng, Yang Wang, Zhangming Zhu

IEEE Trans. Very Large Scale Integr. Syst., March, 2025

HMC Method for Defect Classification and Location of Postbond TSVs.

Changle Zhi, Gang Dong, Deguang Yang, Daihang Liu, Zhangming Zhu

IEEE Trans. Instrum. Meas., 2025

2024

Thermal Modeling and Analysis of 3D ICS with Heat Dissipation Effect of Power Distribution Networks.

Yinghao Feng, Gang Dong, Daihang Liu, Changle Zhi, Deguang Yang, Yang Wang, Zhangming Zhu, Yintang Yang

J. Circuits Syst. Comput., November, 2024

Multiobjective Optimization for PSIJ Mitigation and Impedance Improvement Based on PCPS/DR-NSDE in Chiplet-Based 2.5-D Systems.

Changle Zhi, Gang Dong, Wei Xiong, Deguang Yang, Daihang Liu, Yinghao Feng, Yang Wang, Zhangming Zhu, Yintang Yang

IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., August, 2024

A 3-D Convolutional Network for Fast and Accurate S/Z-Parameters Prediction of Si-Interposer Power Distribution Network With Through Silicon Vias.

Deguang Yang, Gang Dong, Changle Zhi, Daihang Liu, Yinghao Feng, Yintang Yang

IEEE Trans. Circuits Syst. II Express Briefs, May, 2024