Dongkai Shanguan

According to our database¹, Dongkai Shanguan authored at least 2 papers between 2005 and 2007.

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2007

Evaluation of reliability and metallurgical integrity of wire bonds and lead free solder joints on flexible printed circuit board sample modules.

[BibT_eX]

[DOI]

Microelectron. Reliab., 2007

2005

Evaluation of wire bonding performance, process conditions, and metallurgical integrity of chip on board wire bonds.

[BibT_eX]

[DOI]

Microelectron. Reliab., 2005