Dwayne R. Shirley

According to our database, Dwayne R. Shirley authored at least 3 papers between 2008 and 2025.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2025

Chip Board Package Interaction Reliability for Large Size FCBGA Package.

Richard Rao, Sean Hsu, Ivan Tan, Steve Yang, Shrinath Ramdas, Dwayne R. Shirley, Kevin Caffey

Proceedings of the IEEE International Reliability Physics Symposium, 2025

2020

Effects of Wiring Density and Pillar Structure on Chip Package Interaction for Advanced Cu Low-k Chips.

Weishen Chu, Laura Spinella, Dwayne R. Shirley, Paul S. Ho

Proceedings of the 2020 IEEE International Reliability Physics Symposium, 2020

2008

Effect of primary creep and plasticity in the modeling of thermal fatigue of SnPb and SnAgCu solder joints.

Dwayne R. Shirley, Hamid R. Ghorbani, Jan K. Spelt

Microelectron. Reliab., 2008