Hamid R. Ghorbani

According to our database, Hamid R. Ghorbani authored at least 3 papers between 2006 and 2008.

Collaborative distances:

• Dijkstra number of seven.
• Erdős number of seven.

2008

Effect of primary creep and plasticity in the modeling of thermal fatigue of SnPb and SnAgCu solder joints.

Dwayne R. Shirley, Hamid R. Ghorbani, Jan K. Spelt

Microelectron. Reliab., 2008

2006

Temperature profile effects in accelerated thermal cycling of SnPb and Pb-free solder joints.

Yan Qi, Rex Lam, Hamid R. Ghorbani, Polina Snugovsky, Jan K. Spelt

Microelectron. Reliab., 2006

Interfacial thermal stresses in solder joints of leadless chip resistors.

Hamid R. Ghorbani, Jan K. Spelt

Microelectron. Reliab., 2006